1-Core Definition and Process Value

The semi-automatic wafer laminating machine is a precision bonding equipment designed specifically for semiconductor wafers. It mainly completes the precise bonding, fixation, and cutting of wafers and cutting/protective films, providing stable support for subsequent thinning, slicing, and chip picking. The core technological value is reflected in three aspects:

Surface protection: isolate scratches, contamination, and oxidation, protect the front/back circuit structure of the wafer;

Process fixation: firmly attach the wafer to the metal frame to prevent chip scattering and displacement during cutting;

Adaptive picking: Supports UV anti adhesive film bonding, with reduced adhesion after UV irradiation, making it easy to pick up chips without damage.

Compared to pure manual film application, it eliminates defects such as bubbles, wrinkles, and misalignment; Compared to fully automatic film sticking machines, it has a smaller size, lower investment, flexible switching, and is suitable for multiple varieties and small batch production.

2-Key component modules

Vacuum adsorption workbench: Vacuum fixes wafers to ensure no displacement during bonding, supporting quick switching between multiple sizes such as 4/5/6/8 inches;

Membrane material conveying system: automatic film pulling, tension control, suitable for commonly used consumables such as blue film, UV film, pyrolysis film, etc;

Flexible bonding mechanism: anti-static roller/airbag compression, linearly adjustable pressure, achieving bubble free and scratch free bonding;

Cutting and receiving unit: automatic film cutting with circular/spring knife, automatic winding of waste film and isolation paper, reducing manual intervention;

Control and safety system: touch screen parameter setting, light curtain protection, emergency stop, in compliance with SEMI safety specifications.

3-Technical features and core advantages

Stable accuracy: The deviation of the fitting is ≤± 0.5mm, without bubbles or wrinkles, and the yield is significantly higher than manual operation;

Flexible adaptation: support silicon, silicon carbide, gallium arsenide and other wafers, and the front/back facial mask can be attached;

Cost friendly: The equipment investment is only one-third to one-fifth of that of fully automatic models, with a small footprint and simple maintenance;

Easy to operate: one click start, parameter preset, manual only responsible for loading and unloading, reducing the skill threshold;

Clean compatibility: The entire machine is made of anti-static and low dust emitting materials, suitable for cleanroom environments of Class 100/Class 1000.

4-Standard workflow

Loading positioning: Manually place the wafer on the vacuum worktable, adsorb and fix it;

Membrane material transportation: The equipment automatically pulls out the adhesive film to cover the wafer and metal frame;

Compression bonding: The roller/airbag is uniformly pressed to release air, ensuring complete adhesion between the film and the wafer; 

Precise cutting: automatically cut the film along the wafer contour, retaining appropriate margins;

Material cutting and rolling: The finished product is manually taken out, and the equipment automatically rolls up the waste film and enters the next cycle.